Nikki is a veteran educator, librarian, Educational Technology Facilitator and ISTE Librarians Network President Elect. As a way to create sub micron vias between steel layers on silicon IC circuits, the tungsten stuffed by way of processes have been in a continuing state of improvement over the past 15 years. Processing is complex, costly, and difficult to reproduce. The introduction of galvanic cells, through undercutting, and exposed plugs are simply a number of the plagues that have hit a number of users of the technology. Discussed in this paper is an alternate method to the advanced tungsten filled via interconnect … Read More
Star Struggle THE FINAL JEDI VERSION ??? By Twizz Tech
